4 Opteron™, Athlon
MP™, XEON™, Pentium 4™
Highest Available
RDRAM / DDR266 - DDR333 and up to 32GB ECC/REG
6 IDE or SCSI up to 250 GB
Available
Up to 30 in combinations of 10/100 and 10/100/1000
6 - 64-bit / 32-bit / PCI-X / Hyper-Transport
2
2
250W - 500W
Telco or 4 post rack
2U
28 inches
Cooling in the Round™
The Total Densiy W™ is combined with
the Cooling in Round™ Technology making it an Extremely Reliable.
Patent Pending, Cooling in the Round™ is a superior technological
design enabling cooling across crucial components, such as CPU's,
Hard Disks, Power Supplies and other components for INCREASED Reliability
and performance.
One Sided Access™
Integration and administration are made easier
with One Sided Access™ where all connections, power, peripherals
and controls are accessed on the same panel.
Modular Manageability
The Total Density W™ is comprised of two identical independent
2U modules
mounted back to back hence the name double U "W", with
a total depth
of 28 inches. The Total Density W™ server solutions have independent
power supplies for each motherboard within the system. Modularity
makes
the Total Density W™ more flexible. As an example, AMD CPUs
could be used on one end and Intel CPUs on the other for specific
application needs.
Easy maintainability with modular rail
mounting. Each module slides
out of the rack independently allowing the opposite end to still
operate. Standard Form Factor Total Density W™ systems are
high density, 4 processors, 2U servers.
Lan Adapter Tags
All Total Density™ products leave the
manufacturing floor with LAN Adapter IDs clearly visible to make
finding the server easy in a large farm. |